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Journal of Korean Powder Metallurgy Institute :: Vol.27 No.5 pp.388-393
Doi:https://doi.org/10.4150/KPMI.2020.27.5.388
Open abstract -
Low Temperature Debinding Process Using Oxygen Plasma for Flexible Printed Electronics
Journal of Korean Powder Metallurgy Institute :: Vol.19 No.5 pp.343-347
Doi:https://doi.org/10.4150/KPMI.2012.19.5.343
Open abstract